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Assembly
Design Fabrication Assembly

 

[Under Construction]

Lugen Industries can provide your company with assembly services. This allows us to be your "one stop shopping" supplier for electronic packaging designs.

Key Benefits

Purchase of assembly equipment is not required.
Difficult assemblies can be contracted out if in-house facilities are not capable.
Quick turn for short design cycles.

Capabilities

Lugen Industries handles most package technologies available today. If your company has questions regarding the ability to assemble a design, feel free to contact us by phone or email.

Standard Packages
Surface Mount
.050" pitch
.025" pitch
.020" pitch
< .020" pitch
Through Hole
Advanced Technologies
Chip - On - Board (COB)
Multi - Chip Modules (MCM)
Flip - Chip
Ink Technology
Thin Film
Resistors
Capacitors
Dielectric
Metalization
Thick Film
Resistors
Capacitors
Dielectric
Metalization
Wire Bonding
Gold
Ball - Ball
Ball - Wedge
Wedge - Wedge
Aluminum
Ball - Ball
Ball - Wedge
Wedge - Wedge
 

Reference Accounts

           Lugen Industries has done work from Fortune 100 companies down. Due to the non-disclosure              agreements that most companies require Lugen Industries to sign, we are unable to list reference              accounts.

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Send mail to Randy McHugh with questions or comments about this web site.
Last modified: February 05, 1998