Lugen Industries has qualified and experienced electronic packaging engineers to
facilitate the design of your companies complicated designs. By offloading your electronic
packaging design to Lugen Industries during busy portions of your design cycle, you allow
your company to operate more efficiently.
No need for a captive electronic packaging design group
Quick response during heavy design periods.
Optimization of your design phases to shorten time to market.
Ability to answer questions about any step of the design process.
Automation of the manufacturing process.
Most standard substrates are supported. Lugen can design boards in excess of 24" X
18" upto 30 layers. We can also design with 3 mil lines and 3 mil gaps.
Lugen Industries is also capable of handling and designing for advanced substrates.
Substrates like Teflon, Duroid, ceramics, and hybrids (epoxy, GETEK, polyimide, etc.) can
Multi-Chip Modules (MCM)
Multi-Chip Modules have become mainstream at Lugen Industries. High speed designs can
now be put onto an MCM to allow higher total board densities. Let Lugen determine the
optimal MCM technology for both price and performance.
Both thin and thick film technologies can be designed. As with Multi-Chip Modules,
hybrids are mainstream technology for Lugen Industries. If your company has a high power
or RF design, you may want to consider hybrids.
Flex and Rigid-Flex
Flexible circuitry is becoming more dominant. Lugen Industries can design and
manufacture your flex and rigid-flex circuitry. Conformance to the IPC specifications
ensure correct and low fault designs.
Lugen Industries has done
work from Fortune 100 companies down. Due to the non-disclosure
most companies require Lugen Industries to sign, we are unable to list reference
Send mail to Randy McHugh with
questions or comments about this web site.
Last modified: February 05, 1998